1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Actions Semiconductor Co., Ltd.
33 description: Active-Semi International Inc
35 description: Avionic Design GmbH
37 description: Adafruit Industries, LLC
39 description: Adapteva, Inc.
41 description: Adaptrum, Inc.
43 description: AD Holdings Plc.
45 description: Analog Devices, Inc.
47 description: Advantech Corporation
48 "^aeroflexgaisler,.*":
49 description: Aeroflex Gaisler AB
51 description: Annapurna Labs
53 description: Allegro DVT
57 description: Allwinner Technology Co., Ltd.
59 description: AlphaScale Integrated Circuits Systems, Inc.
61 description: Altera Corp.
63 description: Amarula Solutions
65 description: Amazon.com, Inc.
67 description: Applied Micro Circuits Corporation (APM, formally AMCC)
69 description: Advanced Micro Devices (AMD), Inc.
71 description: Shenzhen Amediatech Technology Co., Ltd
73 description: Amlogic, Inc.
75 description: Ampire Co., Ltd.
79 description: AMS-Taos Inc.
81 description: Analogix Semiconductor, Inc.
83 description: Andes Technology Corporation
85 description: Applied Micro Circuits Corporation (APM)
87 description: Aptina Imaging
89 description: Arasan Chip Systems
91 description: ArcherMind Technology (Nanjing) Co., Ltd.
93 description: Arctic Sand
95 description: arcx Inc. / Archronix Inc.
97 description: Aries Embedded GmbH
101 description: ARMadeus Systems SARL
103 description: Arrow Electronics
105 description: Artesyn Embedded Technologies Inc.
107 description: Asahi Kasei Corp.
109 description: ASPEED Technology Inc.
111 description: AsusTek Computer Inc.
113 description: Atlas Scientific LLC
115 description: Atmel Corporation
117 description: AU Optronics Corporation
119 description: Auvidea GmbH
121 description: Avago Technologies
123 description: avia semiconductor
125 description: Shanghai AVIC Optoelectronics Co., Ltd.
127 description: Avnet, Inc.
129 description: Axentia Technologies AB
131 description: Axis Communications AB
133 description: Azoteq (Pty) Ltd
135 description: Shenzhen AZW Technology Co., Ltd.
137 description: BIPAI KEJI LIMITED
139 description: Beckhoff Automation GmbH & Co. KG
141 description: Bitmain Technologies
143 description: BOE Technology Group Co., Ltd.
145 description: Bosch Sensortec GmbH
147 description: Boundary Devices Inc.
149 description: Broadcom Corporation
151 description: Buffalo, Inc.
153 description: B&R Industrial Automation GmbH
155 description: Bticino International
159 description: Capella Microsystems, Inc
161 description: Cascoda, Ltd.
163 description: Catalyst Semiconductor, Inc.
165 description: Cavium, Inc.
167 description: Cadence Design Systems Inc.
169 description: CDTech(H.K.) Electronics Limited
171 description: Ceva, Inc.
173 description: Chipidea, Inc
177 description: ChipSPARK
179 description: Common Hardware Reference Platform
181 description: Chunghwa Picture Tubes Ltd.
183 description: Chuwi Innovation Ltd.
185 description: Computadora Industrial Abierta Argentina
187 description: Cirrus Logic, Inc.
189 description: Cloud Engines, Inc.
191 description: Chips&Media, Inc.
193 description: Conexant Systems, Inc.
195 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
197 description: CompuLab Ltd.
199 description: Chengdu Corpro Technology Co., Ltd.
201 description: Cortina Systems, Inc.
203 description: Cosmic Circuits
205 description: Crane Connectivity Solutions
207 description: Creative Technology Ltd
209 description: Crystalfontz America, Inc.
211 description: Hangzhou C-SKY Microsystems Co., Ltd
213 description: Shenzen Chuangsiqi Technology Co.,Ltd.
215 description: Cubietech, Ltd.
217 description: Cypress Semiconductor Corporation
219 description: CZ.NIC, z.s.p.o.
221 description: Maxim Integrated Products (formerly Dallas Semiconductor)
223 description: DataImage, Inc.
225 description: DAVICOM Semiconductor, Inc.
227 description: Delta Electronics, Inc.
229 description: Denx Software Engineering
231 description: Devantech, Ltd.
233 description: DH electronics GmbH
235 description: Shenzhen Yagu Electronic Technology Co., Ltd.
237 description: Digi International Inc.
239 description: Diglent, Inc.
241 description: Dioo Microcircuit Co., Ltd
243 description: DLC Display Co., Ltd.
245 description: Dialog Semiconductor
247 description: D-Link Corporation
249 description: Data Modul AG
251 description: Domintech Co., Ltd.
253 description: Dongwoon Anatech
255 description: DPTechnics
257 description: Dragino Technology Co., Limited
259 description: dServe Technology B.V.
261 description: Embedded Artists AB
263 description: EBS-SYSTART GmbH
265 description: EBV Elektronik
267 description: Eckelmann AG
269 description: Emerging Display Technologies
271 description: eGalax_eMPIA Technology Inc
273 description: Elan Microelectronic Corp.
275 description: Elgin S/A.
277 description: Shenzhen Embest Technology Co., Ltd.
279 description: Emlid, Ltd.
281 description: EM Microelectronic
282 "^empire-electronix,.*":
283 description: Empire Electronix
285 description: emtrion GmbH
287 description: Endless Mobile, Inc.
289 description: Silicon Laboratories (formerly Energy Micro AS)
291 description: Engicam S.r.l.
293 description: EPCOS AG
295 description: Ecole Polytechnique Fédérale de Lausanne
297 description: Seiko Epson Corp.
299 description: Espressif Systems Co. Ltd.
301 description: ESTeem Wireless Modems
303 description: NI Ettus Research
305 description: Eukréa Electromatique
307 description: Everest Semiconductor Co. Ltd.
309 description: Everspin Technologies, Inc.
311 description: Exar Corporation
315 description: EZchip Semiconductor
317 description: Facebook
319 description: Fairphone B.V.
321 description: Faraday Technology Corporation
323 description: Fastrax Oy
325 description: Fairchild Semiconductor
327 description: Shenzhen Fly Young Technology Co.,LTD.
331 description: FocalTech Systems Co.,Ltd
333 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
335 description: Freescale Semiconductor
337 description: Fujitsu Ltd.
339 description: Gateworks Corporation
341 description: Game Consoles Worldwide
343 description: General Electric Company
345 description: GeekBuying
347 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
349 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
351 description: Gemei Digital Technology Co., Ltd.
353 description: Geniatech, Inc.
355 description: Giantec Semiconductor, Inc.
357 description: Giantplus Technology Co., Ltd.
359 description: Globalscale Technologies, Inc.
361 description: GlobalTop Technology, Inc.
363 description: Global Mixed-mode Technology, Inc.
365 description: Shenzhen Huiding Technology Co., Ltd.
367 description: Google, Inc.
371 description: Garmin Limited
373 description: Gumstix, Inc.
375 description: Gateworks Corporation
377 description: HannStar Display Corporation
379 description: Haoyu Microelectronic Co. Ltd.
381 description: Hardkernel Co., Ltd
383 description: HiDeep Inc.
385 description: Himax Technologies, Inc.
387 description: Hisilicon Limited.
389 description: Hitachi Ltd.
391 description: Hitex Development Tools
393 description: Holt Integrated Circuits, Inc.
395 description: Honeywell
397 description: Hewlett Packard
399 description: HannStar Display Co.
401 description: Holtek Semiconductor, Inc.
403 description: HwaCom Systems Inc.
405 description: Hyundai Technology
407 description: I2SE GmbH
409 description: International Business Machines (IBM)
411 description: IC Plus Corp.
413 description: Integrated Device Technologies, Inc.
415 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
417 description: ILI Technology Corporation (ILITEK)
419 description: Imagination Technologies Ltd.
421 description: In-Circuit GmbH
423 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
425 description: Infineon Technologies
427 description: Inforce Computing
429 description: Ingenic Semiconductor
431 description: Innolux Corporation
433 description: INSIDE Secure
435 description: Intel Corporation
437 description: Inter Control Group
439 description: InvenSense Inc.
441 description: Inverse Path
443 description: Iomega Corporation
445 description: ISEE 2007 S.L.
447 description: Intersil
449 description: Integrated Silicon Solutions Inc.
451 description: ITEAD Intelligent Systems Co.Ltd
453 description: iWave Systems Technologies Pvt. Ltd.
455 description: Japan Display Inc.
457 description: JEDEC Solid State Technology Association
459 description: Shenzhen Jesurun Electronics Business Dept.
461 description: Jiandangjing Technology Co., Ltd.
463 description: Ka-Ro electronics GmbH
465 description: Keith & Koep GmbH
467 description: Keymile GmbH
471 description: Kieback & Peter GmbH
473 description: Kinetic Technologies
475 description: King & Display Technology Co., Ltd.
477 description: Kingnovel Technology Co., Ltd.
479 description: Kionix, Inc.
481 description: Rakuten Kobo Inc.
483 description: Kaohsiung Opto-Electronics Inc.
485 description: Kontron S&T AG
487 description: Sutajio Ko-Usagi PTE Ltd.
489 description: Kyocera Corporation
493 description: Laird PLC
495 description: Ketai Huajie Technology Co., Ltd.
497 description: Lantiq Semiconductor
499 description: Lattice Semiconductor
501 description: LEGO Systems A/S
503 description: Shenzhen LeMaker Technology Co., Ltd.
505 description: Lenovo Group Ltd.
507 description: LG Corporation
509 description: Shenzhen Libre Technology Co., Ltd
511 description: Lichee Pi
513 description: Linaro Limited
515 description: LinkSprite Technologies, Inc.
517 description: Belkin International, Inc. (Linksys)
519 description: Linux-specific binding
521 description: Linx Technologies
523 description: Linear Technology Corporation
525 description: Logic PD, Inc.
527 description: LSI Corp. (LSI Logic)
529 description: Liebherr-Werk Nenzing GmbH
531 description: Macnica Americas
533 description: Mapleboard.org
535 description: Marvell Technology Group Ltd.
537 description: MaxBotix Inc.
539 description: Maxim Integrated Products
541 description: Mobiveil Inc.
545 description: Measurement Specialties
547 description: MediaTek Inc.
549 description: MegaChips
551 description: Shenzhen MeLE Digital Technology Ltd.
553 description: Melexis N.V.
555 description: MELFAS Inc.
557 description: Mellanox Technologies
559 description: MEMSIC Inc.
561 description: Menlo Systems GmbH
563 description: Merrii Technology Co., Ltd.
565 description: Micrel Inc.
567 description: Microchip Technology Inc.
569 description: Micro Crystal AG
571 description: Micron Technology Inc.
573 description: MikroElektronika d.o.o.
575 description: Miniand Tech
577 description: MINIX Technology Ltd.
579 description: MiraMEMS Sensing Technology Co., Ltd.
581 description: Mitsubishi Electric Corporation
583 description: Mosaix Technologies, Inc.
585 description: Motorola, Inc.
587 description: Moxa Inc.
591 description: mqmaker Inc.
593 description: Microsemi Corporation
595 description: Micro-Star International Co. Ltd.
597 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
599 description: Multi-Inno Technology Co.,Ltd
601 description: Mundo Reader S.L.
603 description: Murata Manufacturing Co., Ltd.
605 description: Macronix International Co., Ltd.
607 description: MYIR Tech Limited
609 description: National Semiconductor
611 description: NEC LCD Technologies, Ltd.
613 description: Neonode Inc.
617 description: Broadcom Corporation (formerly NetLogic Microsystems)
619 description: Netron DY
621 description: Shenzhen Netxeon Technology CO., LTD
625 description: Next Thing Co.
627 description: Newhaven Display International
629 description: National Instruments
631 description: Nintendo
633 description: NLT Technologies, Ltd.
637 description: Nordic Semiconductor
639 description: NovTech, Inc.
641 description: NutsBoard
643 description: Nuvoton Technology Corporation
645 description: New Vision Display
649 description: NXP Semiconductors
651 description: Oceanic Systems (UK) Ltd.
653 description: Okaya Electric America, Inc.
655 description: Oki Electric Industry Co., Ltd.
657 description: OLIMEX Ltd.
659 description: One Laptop Per Child
661 description: Onion Corporation
663 description: ON Semiconductor Corp.
665 description: On Tat Industrial Company
667 description: Opal Kelly Incorporated
669 description: OpenCores.org
671 description: OpenRISC.io
673 description: Option NV
675 description: Shenzhen Oranth Technology Co., Ltd.
677 description: Oracle Corporation
679 description: Orise Technology
681 description: Ortus Technology Co., Ltd.
683 description: OSD Displays
685 description: OmniVision Technologies
687 description: Oxford Semiconductor, Ltd.
689 description: Panasonic Corporation
691 description: Parade Technologies Inc.
693 description: Precision Design Associates, Inc.
695 description: Pericom Technology Inc.
697 description: Pervasive Displays, Inc.
699 description: PHICOMM Co., Ltd.
701 description: PHYTEC Messtechnik GmbH
703 description: Picochip Ltd
707 description: Shenzhen PineRiver Designs Co., Ltd.
709 description: PIXCIR MICROELECTRONICS Co., Ltd
711 description: Plantower Co., Ltd
713 description: Plat\'Home Co., Ltd.
717 description: Broadcom Corporation (formerly PLX Technology)
719 description: PNI Sensor Corporation
721 description: Polaroid Corporation
723 description: Portwell Inc.
725 description: Poslab Technology Co., Ltd.
727 description: Point of View International B.V.
729 description: PowerVR (deprecated, use img)
731 description: Primux Trading, S.L.
733 description: PROBOX2 (by W2COMP Co., Ltd.)
735 description: PulsedLight, Inc
737 description: Qualcomm Atheros, Inc.
739 description: Qualcomm Technologies, Inc
741 description: QEMU, a generic and open source machine emulator and virtualizer
743 description: Qi Hardware
745 description: Chengdu Kaixuan Information Technology Co., Ltd.
747 description: QiaoDian XianShi Corporation
749 description: QNAP Systems, Inc.
753 description: RaidSonic Technology GmbH
755 description: Mediatek/Ralink Technology Corp.
757 description: Ramtron International
759 description: Raspberry Pi Foundation
761 description: Raydium Semiconductor Corp.
763 description: Unisoc Communications, Inc.
765 description: Realtek Semiconductor Corp.
767 description: Renesas Electronics Corporation
769 description: Shenzhen Rervision Technology Co., Ltd.
771 description: Richtek Technology Corporation
773 description: Ricoh Co. Ltd.
775 description: Rikomagic Tech Corp. Ltd
777 description: RISC-V Foundation
779 description: Fuzhou Rockchip Electronics Co., Ltd
781 description: ROCKTECH DISPLAYS LIMITED
783 description: ROHM Semiconductor Co., Ltd
785 description: Ronbo Electronics
787 description: Shenzhen Roofull Technology Co, Ltd
789 description: Samsung Semiconductor
791 description: Samtec/Softing company
793 description: Sancloud Ltd
795 description: Sandisk Corporation
797 description: Smart Battery System
799 description: Schindler
801 description: Seagate Technology PLC
803 description: Shenzhen SEI Robotics Co., Ltd
805 description: Semtech Corporation
807 description: Sensirion AG
809 description: Small Form Factor Committee
811 description: Solomon Goldentek Display Corporation
813 description: SGX Sensortech
815 description: Sharp Corporation
817 description: Shimafuji Electric, Inc.
819 description: Si-En Technology Ltd.
821 description: Silicon Linux Corporation
823 description: SiFive, Inc.
825 description: Sigma Designs, Inc.
827 description: Seiko Instruments, Inc.
829 description: Silicon Image
831 description: Silicon Laboratories
833 description: Silead Inc.
835 description: Silergy Corp.
837 description: Silicon Mitus, Inc.
839 description: Cypress Semiconductor Corporation (Simtek Corporation)
841 description: Sinlinx Electronics Technology Co., LTD
843 description: SinoVoip Co., Ltd
845 description: Shenzhen Sipeed Technology Co., Ltd.
847 description: SiRF Technology, Inc.
849 description: Silicon Integrated Systems Corp.
851 description: Sitronix Technology Corporation
853 description: Skyworks Solutions, Inc.
855 description: Standard Microsystems Corporation
857 description: Synopsys, Inc.
859 description: Shenzhen SoChip Technology Co., Ltd.
861 description: Socionext Inc.
863 description: SolidRun
865 description: Solomon Systech Limited
867 description: Sony Corporation
869 description: Spansion Inc.
871 description: Spreadtrum Communications Inc.
873 description: Silicon Storage Technology, Inc.
875 description: STMicroelectronics
877 description: Starry Electronic Technology (ShenZhen) Co., LTD
881 description: ST-Ericsson
883 description: ST-Ericsson
885 description: Summit microelectronics
887 description: Shenzhen Sunchip Technology Co., Ltd
889 description: Sun Microsystems, Inc
891 description: Sierra Wireless
893 description: Synaptics Inc.
895 description: Synology, Inc.
897 description: TBS Technologies
898 "^tbs-biometrics,.*":
899 description: Touchless Biometric Systems AG
901 description: Trusted Computing Group
903 description: Toby Churchill Ltd.
905 description: TechNexion
907 description: Technologic Systems
909 description: Tempo Semiconductor
911 description: Shenzhen Techstar Electronics Co., Ltd.
913 description: Terasic Inc.
915 description: THine Electronics, Inc.
917 description: Texas Instruments
919 description: Tianma Micro-electronics Co., Ltd.
921 description: Trusted Logic Mobility
923 description: Tecon Microprocessor Technologies, LLC.
927 description: Toradex AG
929 description: Toshiba Corporation
933 description: TPK U.S.A. LLC
935 description: TP-LINK Technologies Co., Ltd.
939 description: TQ Systems GmbH
943 description: Tronsmart
945 description: Truly Semiconductors Limited
947 description: Theobroma Systems Design und Consulting GmbH
949 description: Tyan Computer Corporation
953 description: uCRobotics
955 description: Ubiquiti Networks
959 description: United Western Technologies Corp (UniWest)
961 description: uPI Semiconductor Corp.
963 description: United Radiant Technology Corporation
965 description: Universal Scientific Industrial Co., Ltd.
967 description: Aigo Digital Technology Co., Ltd.
969 description: V3 Semiconductor
971 description: Vamrs Ltd.
973 description: Variscite Ltd.
975 description: VIA Technologies, Inc.
977 description: Virtual I/O Device Specification, developed by the OASIS consortium
979 description: Vishay Intertechnology, Inc
981 description: Vitesse Semiconductor Corporation
983 description: Vivante Corporation
985 description: VoCore Studio
987 description: Voipac Technologies s.r.o.
989 description: Vision Optical Technology Co., Ltd.
991 description: Western Digital Corp.
993 description: WeTek Electronics, limited.
997 description: Shenzhen whwave Electronics, Inc.
999 description: Wi2Wi, Inc.
1001 description: Winbond Electronics corp.
1003 description: Winstar Display Corp.
1005 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1007 description: Wolfson Microelectronics
1009 description: Wondermedia Technologies, Inc.
1013 description: X-Powers
1015 description: Extreme Engineering Solutions (X-ES)
1017 description: Xillybus Ltd.
1021 description: Shenzhen Xunlong Software CO.,Limited
1022 "^yones-toptech,.*":
1023 description: Yones Toptech Co., Ltd.
1025 description: Y Soft Corporation a.s.
1027 description: Zarlink Semiconductor
1029 description: ZEITEC Semiconductor Co., LTD.
1031 description: Shenzhen Zidoo Technology Co., Ltd.
1033 description: Zodiac Inflight Innovations
1035 description: ZTE Corp.
1037 description: ZyXEL Communications Corp.
1039 # Normal property name match without a comma
1040 # These should catch all node/property names without a prefix
1041 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1042 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1045 additionalProperties: false