Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael...

Merge tag 'thermal-6.4-rc1-2' of git://git./linux/kernel/git/rafael/linux-pm

Pull more thermal control updates from Rafael Wysocki:
 "These are mostly cleanups on top of the previously merged thermal
  control changes plus some driver fixes and the removal of the Intel
  Menlow thermal driver.

  Specifics:

   - Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
     check warning (Stefan Wahren)

   - Update the example in the DT bindings to reflect changes with the
     ADC node name for QCom TM and TM5 (Marijn Suijten)

   - Fix comments for the cpuidle_cooling_register() function to match
     the function prototype (Chenggang Wang)

   - Fix inconsistent temperature read and some Mediatek variant board
     reboot by reverting a change and handling the temperature
     differently (AngeloGioacchino Del Regno)

   - Fix a memory leak in the initialization error path for the Mediatek
     driver (Kang Chen)

   - Use of_address_to_resource() in the Mediatek driver (Rob Herring)

   - Fix unit address in the QCom tsens driver DT bindings (Krzysztof
     Kozlowski)

   - Clean up the step-wise thermal governor (Zhang Rui)

   - Introduce thermal_zone_device() for accessing the device field of
     struct thermal_zone_device and two drivers use it (Daniel Lezcano)

   - Clean up the ACPI thermal driver a bit (Daniel Lezcano)

   - Delete the thermal driver for Intel Menlow platforms that is not
     expected to have any users (Rafael Wysocki)"

* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal: intel: menlow: Get rid of this driver
  ACPI: thermal: Move to dedicated function sysfs extra attr creation
  ACPI: thermal: Use thermal_zone_device()
  thermal: intel: pch_thermal: Use thermal driver device to write a trace
  thermal: core: Encapsulate tz->device field
  thermal: gov_step_wise: Adjust code logic to match comment
  thermal: gov_step_wise: Delete obsolete comment
  dt-bindings: thermal: qcom-tsens: Correct unit address
  thermal/drivers/mediatek: Use of_address_to_resource()
  thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
  thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
  thermal/drivers/mediatek: Add temperature constraints to validate read
  Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
  thermal/drivers/cpuidle_cooling: Delete unmatched comments
  dt-bindings: thermal: Use generic ADC node name in examples
  dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible